The total investment of the project is about 20 billion US dollars.
It is expected to build a 14nm logic process production line.
2024 is expected to have a total capacity of 60,000 pieces per month.
Established in November 2017, Wuhan Hongxin Semiconductor Manufacturing Co., Ltd. (HSMC) is headquartered in the Airport Economic and Technological Development Zone, Dongxihu District, Wuhan, China. The company owns the global leading expert team in the field of semiconductor wafer research, development and manufacturing, with rich experience in advanced FinFET logic process and advanced wafer level packaging technology for nodes under 14 nm. and 7 nm. Adhering to the concept of serving the country with “core” and realizing the dream of China, having its foothold in Wuhan, covering the whole country, having the whole world in view, aiming at the goal of highly independent advanced wafer and packaging manufacturing technology in the integrated circuit industry...
Flagged by the 14-nanometer process and continued to target below 7 nm
Long-life node, parallel development of wafer-level advanced packaging technology to accumulate China's advanced......
Pay attention to efficiency and create a pleasant working environment
Unite and cooperate to form a solid scientific and technological team
In the spirit of "active pursuit, first layout, leading technology, and innovative mode",Hongxin Semiconductor has three major objectives: to catch up with semiconductor process technology......