Established in November 2017, Wuhan Hongxin Semiconductor Manufacturing Co., Ltd. (HSMC) is headquartered in the Airport Economic and Technological Development Zone, Dongxihu District, Wuhan, China. The company owns the global leading expert team in the field of semiconductor wafer research, development and manufacturing, with rich experience in advanced FinFET logic process and advanced wafer level packaging technology for nodes under 14 nm. and 7 nm. Adhering to the concept of serving the country with “core” and realizing the dream of China, having its foothold in Wuhan, covering the whole country, having the whole world in view, aiming at the goal of highly independent advanced wafer and packaging manufacturing technology in the integrated circuit industry, the company sets up the most advanced “integrated system” production line of semiconductor logic process and wafer level packaging for the increasingly powerful electronic technology industry and chip design industry in China. At the same time, with the innovative business model, the company offers assistance for the application and comprehensive popularization of China’s world-leading 5G and AI technology in mobile terminal, high-speed computing, Internet of things devices, automotive electronics and other scientific and technological fields.
The total investment of Wuhan Hongxin Project is approximately 20 billion dollars. The main investment projects are:
It is expected to build a 14 nanometer logic process production line with a total capacity of 30000 pieces per month
It is expected to build a logic process production line with a total capacity of 30000 pieces per month
It is expected to build wafer level advanced packaging production line