Wuhan Hongxin Semiconductor Manufacturing Co., Ltd. was founded in November 2017. Engaged in manufacturing services of wafers with advanced logic technology up to 14nm~7nm. Detailed timelines are as follows:
14-nm independent technology research and development project:
In March, 2019, the technical research and development plan was launched, and the construction period of the first phase of the plant is now under way. The main building structure has now been completed. Dust-free room project is expected to be completed in October, and the equipment & machines are being procured and contracted, which is expected to be put into operation in November this year. Mask fabrication, technical development and mass production adjustment will be started as the same time. The first test of the chip tape-out and the first test of the function of the SRAM master disk will be started in the second half of 2020.
7-nm independent technology research and development project:
In 2020, we will start the research and development of 7Nm independent technology. It aims to start the first test of chips and the first function test of SRAM motherboard in the third quarter of 2021.