0086-27-83371192

 

No.9, East Shizi Street, Jinghe Subdistrict, Dongxihu District, Wuhan

 

Mailbox:info@hsmc-email.com

Mobile website

Copyright ©  Wuhan Hongxin Semiconductor Manufacturing Co., Ltd.          鄂ICP备18006486号-1          Powered by www.300.cn

>
Product Profile

Product Profile

Aiming at the advanced logic and technology requirements of four application platforms, namely mobile terminal, high-speed computing, internet of things device and automotive electronics, driven by AI/5G and facing the global market scale of at least 3.5 million 14-nm wafers and 2 million 7-nm wafers in five years, Wuhan Hongxin Semiconductor will provide the following platform solutions for 14-nm and 7-nm technologies:

 

14-nm Technology

Platform Solutions

Transistor component

Target Products

Hi-speed/Low-power/Mainstream
(HS/LP/Mainstream)

Baseband processors, application processors, AI accelerators, image processors, smart voice and image recognition chips and high-end master chips for 4G/mainstream spec. smartphones/tablets, Netcom products, artificial intelligence Internet of Things products (AIoT) and automotive L1 ~ L3 Advanced Driver Assistance Systems (ADAS) and other applications.

RF Device

4G Smartphone RF chip, Sub-6 GHz Smartphone RF chip, WiFi/Bluetooth chip, Internet of Things RF chip (NBIoT/LoRA), etc

Ultra-low leakage (ULL)

IoT chip, master chip of AI edge device, etc.

Mixed-signal (MS)

High-resolution high-speed real-time analog-to-digital convert (ADC)/digital-to-analog converter (DAC), high-order mixed signal chip, high-order digital power management chip, etc.

Embedded Non-volatile memory (eNVM)

High-order microcontrol unit (MCU), IoT real-time computing chip, master chip of AI edge device, etc.

 

7-nm Technology

Platform Solutions

Transistor Component

Target Products

High performance

Baseband chip, application processor, AI accelerator, image processor, smart voice and image recognition chip, server master chip for high-order advanced smartphones, cloud servers, artificial Intelligence Internet of Things (AIoT) and L3 ~ L5 Advanced Driver Assistance Systems (ADAS) and other applications.

RF Device

Sub-6 GHz smartphone RF chip with 5G, 30 GHz or more RF chip with 5G millimeter wave, 70 GHz or more self-driving millimeter wave radar chip, etc.

Hi-speed/Low-power/Mainstream
(HS/LP/Mainstream)

Baseband processors, application processors, AI accelerators, image processors, smart voice and image recognition chips and high-end master chips for 5G/mainstream spec. smartphones/tablets, Netcom products, artificial intelligence Internet of Things products (AIoT) and automotive L1 ~ L3 Advanced Driver Assistance Systems (ADAS) and other applications.

Mixed-signal (MS)

Locking the high-resolution high-speed real-time analog-to-digital convert (ADC)/digital-to-analog converter (DAC), high-order mixed signal chip, high-order digital power management chip, etc.

Embedded Non-volatile memory (eNVM)

High-order microcontrol unit (MCU), IoT real-time computing chip, master chip of AI edge device, etc.